Frontgrade reduces product and program costs with a high level of automation in the assembly processes.  Nearly 10,000 modules flow through Frontgrade factories each month.

Partnering with customers to leverage design for manufacturing engineering techniques, Frontgrade factories are capable of complex manufacturing of microwave and millimeter wave assemblies.

Employing automated pick and place, automated wire bonding and automated optical inspection, Frontgrade factories enable programs to reap benefits of volume production.

When the highest levels of reliability and performance are needed along with stringent requirements in the areas of size, form factor, power and thermal management, Frontgrade offers advanced microelectronics packaging, modeling and testing solutions for third-party ASICs and commercially-sourced die.

Building on a heritage of providing custom package solutions for the most demanding aerospace, defense and medical IC products developed at Frontgrade, we have a proven capability to identify, select and design a solution tailored to the unique requirements of your mission. Our flexible engagement model allows us to support a range of services from rapid prototyping of a small number of die for validation and characterization to full volume production in our DMEA accredited trusted facilities. Numerous package technology and process flow options are available, ranging from ceramic QML to organic commercial packages.

System in Package (SiP) solutions leveraging 2.1D technology to place multiple die in a single package are available to enable smaller footprints, increased performance and the integration of die fabricated in different process technologies or wafer types. A full suite of electrical, thermal and mechanical modeling tools are used throughout the development process to ensure compliance with critical design points and constraints.
 

Accredited by the United States Department of Defense as a Trusted Source and as a Category 1A supplier for assembly services, Frontgrade offers build-to-print and build-to-specification capabilities, including high-volume automated circuit card assembly.

For customers designing for military, space, aerospace and other harsh environments, Frontgrade also provides complete COTS and commercial up-screening for high reliability applications that require additional testing and burn-in as well as qualified assembly and test services meeting the requirements of MIL-PRF-38534 Class H and K.

From DC to 40 GHz, Frontgrade provides microelectronic packaging and test solutions for high speed digital, precision analog and RF/microwave devices. Frontgrade carries a range of off-the-shelf inventory and customized options including single board computers; multi-chip, power converter and telemetry modules as well as specialized RF and microwave filters. Our multi-chip module (MCM) packaging technology enables customers to optimize size, weight, power and cost (SWaP) by applying flip chip, chip and wire, chip-on-board, surface mount technology and planar magnetics. In many cases, more than one of these technologies can be combined in a single module.

Offering a full turnkey electronic manufacturing operation complete with testing and coating capabilities in the USA.

Frontgrade has a broad range of well-established Electronic Manufacturing Services (EMS) offerings that support standard product designs and custom microelectronic solutions. Our flexible engagement model, strong collaboration and communication processes allow our customers to outsource everything from circuit card design and assembly to complete turnkey solutions and testing with full ITAR compliance. All Frontgrade EMS sites are fully certified and qualified to assume the most demanding design challenges for customers serving military, aerospace, medical and industrial markets.

Frontgrade EMS solutions provide design, manufacturing, supply chain management and service support for the complete product life cycle to enable our customers to focus on product innovation and differentiation. Our services extend to materials procurement, prototype engineering and qualification, mission suitability analysis, environmental testing and failure analysis, radiation testing, device screening, custom and commercially available plastic packaging and rapid prototype IC assembly.